Type I TMA
Type II TMA
The following overview and installation instructions are for professional system integrators building PCs based on the BTX form factor that use Intel® Pentium® 4 processors in the 775-land package with industry-accepted motherboards, chassis, and peripherals. It contains technical information intended to aid in system integration. Boxed Intel Pentium 4 Processor product information can also be found in the processor Product Brief, Frequently Asked Questions, and Semtelling Guide for the Pentium 4 Processor. (The term "Pentium 4 processors in the 775-land package" refers to Pentium 4 processors in the Flip-Chip Land Grid Array (FC-LGA4) package.) Access Platform Compatibility Guide information here.
Caution about the BTX thermal solutions and BTX chassis: BTX boxed processors are available with two types of thermal solutions. They are Type I Thermal Module Assembly (TMA) and Type II Thermal Module Assembly (TMA). The keep-out zones on the board for both types of TMA are the same. However, the height of the Type I TMA is more than the height of the Type II TMA. Each type of TMA should go into its respective chassis. Type I TMA will not fit in a Type II chassis due to the height difference. Type II TMA should not be used in a Type I chassis as the height of the TMA will be less than the height of the chassis. Therefore the Type II TMA will not seal against the Type I chassis wall resulting in an extremely poor acoustic and thermal performance.
Table of Contents
The Boxed Intel® Pentium® 4 Processor in the 775-Land Package- Processor Overview
- Boxed Processor Contents
- Identifying a Boxed Processor
- Platform Component Selection
- Motherboard Selection
- Chassis Selection
- Power Supply Selection
Section Contents Identifying a Boxed Processor >
The Intel Pentium 4 Processor is based on the Intel® NetBurst™ micro-architecture and includes several new performance enhancing features.
Hyper-Threading Technology:
The Pentium 4 processor supporting Hyper-Threading Technology increases processor efficiency by executing more than one instruction thread at a time. This technology is designed to deliver superior performance with multi-threaded applications and in multi-tasking environments.Enhanced Intel SpeedStep® Technology (EIST):
When running applications that demand less processor power, the Operating System will slow the processor clock speed down. Enabling of EIST can lead to power efficient systems that can run quieter and cooler. (This feature only available on certain Intel processors.) See the EIST How To document for specific requirements and integration procedures.Intel® 64:
The enhancement enables the desktop processor platform to access larger amounts of memory. With appropriate 64-bit supporting hardware and software, platforms based on an Intel processor supporting Intel® 64 can enable use of extended virtual and physical memory. Intel 64 provides flexibility for 32-bit now and future software that supports 64 bit computing. (This feature only available on certain Intel processors.) See the Intel® 64 How to document for specific requirements and integration procedures.Hyper Pipelined Technology:
A deeper pipeline allows instructions inside the processor to be queued and executed at the fastest possible rate. Eleven pipeline stages have been added to the processors to accommodate the bigger L1 and L2 cache sizes. The deep pipelines will provide headroom for additional frequency and performance scaling improvements.Streaming SIMD Extensions: Thirteen additional instructions have been added to the existing 144 instructions, including SIMD double precision floating-point, SIMD 128-bit integer, and cache and memory management instructions. SSE3 enhances performance to accelerate the most demanding aspects of Internet computing, as well as video, speech, encryption, imaging, and non-threaded workstation applications.
800-MHz Intel® NetBurst™ Micro-Architecture System Bus:
High speed system bus transfer rate helps speed the transfer of information from the processor to the rest of the system, improving throughput and performance. Also provides the user with the flexibility to take advantage of higher system memory bandwidth.Advanced Dynamic Execution:
This characteristic extends the dynamic execution features found in previous-generation P6 microarchitecture. Improved branch prediction accelerates the flow of work to the processor and helps overcome the deeper pipeline. Very deep, out-of-order speculative execution carries out over 100 instructions speculatively, ensuring that the processor’s superscalar execution units remain busy and deliver better performance overall.Enhanced Floating Point/Multimedia Unit:
A 128-bit floating-point port and a second port for data movement enable smooth lifelike 3D and graphics.65nm Process Technology:
The 65nm process technology is the latest in Intel manufacturing and technology providing industry-leading density, performance and power reduction features. Intel's leading strained silicon technology, first implemented in 90-nm process technology is further enhanced in the 65nm technology.90nm Process Technology:
The 90nm process technology is the previous generation technology in Intel manufacturing and technology leadership allowing for transistor advantages such as strained silicon lattice to deliver faster transistors and potentially increase performance.1 MB L2 Advanced Transfer Cache:
Enhances performance by providing fast access to heavily used data and instructions.Execution Trace Cache:
Advanced L1 instruction cache removes decoder pipeline latency, and caches "decoded" instructions, thus improving efficiency and hit rate to cached instructions. Greatly improves instruction cache efficiency, maximizing performance on frequently used sections of software code.Rapid Execution Engine:
Integer Arithmetic Logic Unit (ALU) clocked at twice the core frequency provides four ALUs of computing bandwidth and allows lower latency execution increasing performance for certain integer operations.The Intel® NetBurst™ micro-architecture enables the Pentium 4 Processor to achieve breakthrough performance for visual computing, concurrent application environments, and the future of the Internet.
Included with the Boxed Intel® Pentium® 4 Processor in the 775-land Package
- Intel® Pentium® 4 Processor in the 775-land package
- Intel Designed Thermal Module Assembly (includes high quality variable speed fan heatsink and attachment assembly)
- Thermal interface material (attached to the heatsink)
- Installation Instructions and Certificate of Authenticity
- Intel® Inside logo label
The Pentium 4 Processor in the 775-land package refers to Pentium 4 processors in the 775-land Flip-Chip Land Grid Array (FC-LGA4) package with an Integrated Heat Spreader (IHS) that aids in heat dissipation to a properly attached fan heatsink.
Figure 1.
Top View
Bottom View
Intel® Pentium® 4 Processor in the 775-land FC-LGA4 Package
In an effort to create higher performing fan heatsinks, designers will increase fan speed which thereby produces greater acoustic noise. To limit an increase in this noise, Intel has added an option to the boxed processor that allows system integrators to have a quieter system in many usage situations.
Previous generation boxed Intel fan heatsinks contain built-in circuitry to control fan speed. They have a thermistor in the fan hub which measures the chassis ambient air temperature. The fan circuitry then adjusts the fan speed to properly cool the processor at the slowest speed allowable. If the chassis ambient temperature is cool then the processor will run slower and quieter. If the ambient temperature is hot, then the fan will run faster.
This fan was designed to work in a variety of operating conditions so it had to be designed in such a way that it would cool the processor when running at its maximum power at any given ambient temperature (up to 38C). In normal operating environments the processor is running at its maximum power only a fraction of the time.
Under most conditions the fan is spinning faster and louder than necessary. (The fan heatsink is required to work this way so that it will properly cool the CPU in all specified operating environments.)
Intel has been aware of customer concerns over increasing fan noise. Intel has now designed a new fan speed control technology to take advantage of the fact that the processor is not always running at its maximum power. This was done by basing the fan speed control on actual CPU temperature and power usage.
The speed of the new fan heatsink is controlled by the additional 4th wire of the fan cable. (The new technology is sometimes referred to as "4-wire fan speed control.")
The additional 4th wire sends a signal from the motherboard to the fan heatsink to control its speed. There is a thermal diode in the processor which measures actual CPU temperature. The processor sends information to the motherboard about its specific thermal requirements and the actual processor temperature. The motherboard then uses this information to optimally control the speed of the processor fan.
Figure 2 shows the current fan speed curve (red) of a 3-wire, fan heatsink-thermistor based fan speed control. The additional curves in blue represent fan operations at lower CPU temperature and power consumption levels based on the 4-wire fan speed control fan heatsink.
Table 1. Boxed Processor Variable Fan Heatsink Set Points
| For Boxed Intel® Pentium® 4 Processors in the 775-land package | |
| External Chassis Temperature(°C) | Boxed Processor Fan Heatsink Set Points |
X <= 231 | Min Temp: Fan speed constant at lowest fan speed. Recommended temperature for nominal operating environment. |
Z >= 351 | Max Temp: Fan speed constant at highest fan speed. |
1 Set point variance is approximately ±1°C from fan heatsink to fan heatsink.
2 Note: the processor fan speed is also determined by CPU usage and temperature. The temperatures indicated only refers to the thermistor temperature in the fan hub.
Figure 2. External Chassis Temperature Effect On Boxed Processor Variable Speed Fan Heatsink RPM
The Max Temp in figure 2 represents the upper set point or worse case ambient temperature of 38C. The Min Temp represents the lower set point or the slowest possible fan speed at an ambient temperature of 30C. (Also see Table 1)
The acoustic benefits of the 4-wire based fan speed control may vary depending on the specific motherboard implementation. (The acoustic benefits are reliant on the motherboard design.)
If the new 4-pin active fan heat sink solution is connected to an older 3-pin motherboard
CPU fan header it will default back to a fan heatsink thermistor controlled mode, allowing compatibility with existing 3-pin motherboard designs. The fan heatsink has onboard circuitry that will control the fan speed based on internal chassis ambient temperature.
A 4-wire fan does not guarantee a quieter system. If the processor is being used in a hot environment and under heavy loads the fan will have to run fast enough to properly cool the processor. The external chassis temperature (room temperature) will influence the fan speed. A cooler room temperture will allow the fan to run more slowly while a hot room while cause the fan to run faster. Selecting the correct chassis and verifying proper thermal management is critical for integrating a high quality boxed Intel Pentium 4 processor-based system (see Thermal Management for Boxed Intel Pentium 4 Processor-Based Systems)
Identifying a Boxed Processor
Boxed processor test specifications (or S-Specs) marked on the integrated heat spreader of the Pentium 4 Processor identify specific information about the processor. Using the S-Spec Reference Table or the Processor Spec Finder and the information marked on the processor, a system integrator can verify the appropriate processor number, speed rating, stepping, lot number, serial number and other important information about the processor. The numbers marked on the processor should match the numbers on the processor box label (see Figure 3).
Figure 3. Processor Box Label
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Once the boxed processor is installed into a system, the fan heatsink covers the integrated heat spreader and all the markings on the processor. The label on the box of the boxed processor (that has the processor number, speed information, test specification, and lot number) should be photo copied and taped to the inside of the chassis for reference. This will allow quick access to the information that is no longer available on the top of the processor when the heatsink is installed. If a system's processor is later upgraded or replaced causing the photocopied information inside the chassis to have incorrect information, the photocopy should be replaced, removed or visibly marked as obsolete to avoid confusion.
Motherboard Selection
Motherboards used with the Pentium 4 processor in the 775-land package must specifically support the Intel NetBurst micro-architecture 800MHz system bus. Also, the Pentium 4 processor in the 775-land package must be used in a motherboard with a Land Grid Array 775 (LGA775) socket. It is important to verify that the specific motherboard model and revision support the specific Pentium 4 Processor number being used.
Motherboards that support the Pentium 4 processor and are based on the BTX form factor specification can also utilize power supplies that work with the ATX form factor family. Similarly, microBTX form factor motherboards that support the Pentium 4 processor can use the same power supplies as micro ATX systems. The power supply selection will depend heavily on the chassis design and the your total system power demands. Go to the Form Factors website or see the tested power supply list for more information about new power supplies to support the BTX form factor.
Platform Compatibility Guide
To reduce confusion in proper motherboard selection, Intel has created a compatibility naming convention called, "Platform Compatibility Guide." "04B," and "04A," will be the first Platform Compatibility Guides to be introduced. (Future specifications will use similar Platform Compatibility Guides where the first two digits represent the year the Guide is introduced and the 3rd digit stands for the market segment. "A" applies to processors that fall in the Mainstream 2, 1 and Value market segments; where "B," applies to processors that fall in the Performance and Mainstream 3 market segments. Intel product dealers can view the Desktop Processor Roadmap which shows which processors fall under the various market segments. Additionally, Platform Compatibility Guide information for a specific processor can be found on the Processor Spec Finder)
Figure 4. Platform Compatibility Guide Location On Box
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All of the Boxed Intel® Pentium® 4 processors in the FC-LGA4 package will have markings on the box with either, "Platform Compatibility 04B," or, "Platform Compatibility 04A." See figure 4 for example of how processors will be marked.
Motherboards that support processors with the Platform Compatibility Guide (PCG) 04B specification will support processors with the PCG 04B and 04A. (In other words, Motherboards designed to PCG 04B are backwards compatible with 04A processors.) Motherboards that only support processors with the PCG 04A will not support PCG 04B processors. These motherboards have been designed to provide customers with a lower cost platform.
Platform Compatibility Guides do not promise compatibility. Platform Compatibility Guides specify likely motherboard compatibility with processor electrical requirements. Compatible BIOS, drivers, hardware, and operating system are required.
Some boxed Intel processors in the 775-land package may not indicate a Platform Compatibility Guide such as the boxed Intel® Pentium® 4 processor with HT Technology Extreme Edition. This processor has additional electrical requirements that are not captured in the Platform Compatibility Guides.
Additionally, a BIOS upgrade may be required in order to properly recognize and initialize the latest stepping of the Pentium 4 Processor. Motherboards must also meet the electrical and mechanical specifications of the Pentium 4 Processor, as documented in the Datasheet. Intel tests motherboards for basic compatibility and lists passing boards on the Tested Motherboard List for the Boxed Intel Pentium 4 Processor.
Motherboard Compatibility for Pentium 4 Processors Supporting Hyper-Threading Technology2: Ensure that you are using a motherboard that is compatible with the Pentium 4 processor supporting Hyper-Threading Technology. Enabling HT Technology functionality for your system requires a Pentium 4 processor supporting HT Technology, a motherboard that supports HT Technology (a BIOS upgrade may be required in order to enable HT Technology support), and an operating system that includes optimizations for HT Technology (Windows* XP or certain versions of Linux*). Consult your motherboard manufacturer for compatibility.
Motherboard Compatibility for Intel® Pentium® 4 Processors with 65nm technology:
Processors with 65nm technology require motherboards with specific versions. This is especially important for Intel® 915 chipset based boards and third party chipset based boards. Support of these processors on later chipsets may require a BIOS update.
For additional information on integrating systems based on the Pentium 4 processor supporting Hyper-Threading Technology, refer to the Integration Overview for Systems Based on the Intel Pentium 4 Processor Supporting Hyper-Threading Technology.
Fan Heatsink Support
The boxed processor includes a high quality unattached fan heatsink specifically designed to provide sufficient cooling to the Pentium 4 Processor when used in a suitable chassis environment. The fan power cable must be connected to the motherboard power header as shown in the processor installation notes (included in the boxed processor package).
The motherboard 4-pin header uses two pins to supply +12V (power) and GND (ground). The fan uses the third pin to transmit fan-speed information to motherboards. The fourth pin allows motherboards that support 4-wire fan-speed control to control the fan speed based on actual processor power consumption. The 4-pin connector is keyed to be backwards compatible with a 3-pin motherboard header. The motherboard must have a 4-pin or 3-pin fan power header located close to the socket. Note: Refer to your motherboard manual for the location of the CPU fan power header.
Figure 5. Example of Support and Retention Module Figure 6. Alignment of SRM Slots while Installing
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Systems based on the Pentium 4 Processor in the 775-land package must use a chassis that complies with the BTX specification revision 1.0 or later. Intel recommends system integrators use BTX form factor motherboards to choose a chassis that complies with the current BTX specification. It is strongly recommended that system integrators perform thermal testing on the chassis selected for each configuration of Pentium 4 processor-based systems, even when using a chassis on the tested chassis list.
Chassis Considerations: Support and Retention Module
Most chassis that are BTX compliant should have a component in the chassis base pan known as the Support and Retention Module (SRM). This added feature serves three purposes:
- The Thermal Module Assembly is screwed directly to the SRM
- Provides the neccessary structural ridgity and support for the Thermal Module Assembly
- Provides alignment slots for easy Thermal Module integration
If the chassis does not have an SRM (Figure 5) it may not adequatly support the Thermal Module Assembly and could cause damage to the system components during shipping and handling. Also notice in Figure 6 that the thermal module assembly has slots that will align with the SRM to aid in assembly.
Power Supply Selection
Power supplies must comply with the power supply design guides found on the Form Factors website and supply additional current on the 12V power rail through a 2x2 connector. All Pentium 4 processor-based systems require either the standard 2x10, 20-pin main power connector or the new 24-pin main power connecter as well as the 2x2, 4-pin 12V connector. Consult the motherboard documentation to determine power supply requirements. Intel tests power supplies to determine a minimum level of electrical compliance. Consult the Tested Power Supply List for more information.
Top of Section > Table of Contents >
Section ContentsIntegrating Systems Based on Intel Pentium 4 Processors in the 775-land Package
Motherboards supporting the boxed Intel Pentium 4 Processor include a manual with installation instructions. Consult this manual in addition to the boxed processor manual before building a Pentium 4 processor-based system. The following information can aid system integrators in successfully integrating a BTX system based on the boxed Intel Pentium 4 processor in the 775-land package. Note: When integrating a Pentium 4 processor-based system, be sure to take the proper electrostatic discharge (ESD) precautions. Consider using ground straps, gloves, ESD mats, or other protective measures to avoid damaging the processor and other electrical components in the system.
Motherboard Handling
- Remove Motherboard from ESD bag (if applicable)
- Visually inspect to ensure socket load lever and load plate are secured: CAUTION: Recommend not to open the socket at this time.
- Visually inspect to ensure socket protective cover is present and properly secured.
CAUTION: Recommend not to remove the socket protective cover
CAUTION: DO NOT TOUCH SOCKET SENSITIVE CONTACTS
| Figure 7. Do Not Touch Socket Contacts Larger View > | Figure 8. Opening the Socket Larger View > | Figure 9. Remove Protective Cover Larger View > |
NOTE: Glove images are for illustrative purposes only. Please consult local safety guidelines for specific requirements. It is recommend not to hold the load plate as a lever, instead hold at tab with left hand, removing the protective cover with right hand. | ||
Socket Preparation
- Opening the socket: Note: Apply pressure to the corner with right hand thumb while opening/closing the load lever, otherwise lever can bounce back like a "mouse trap" and WILL cause bent contacts (when loaded).
- Disengage Load Lever by depressing down and out on the hook to clear retention tab
- Rotate Load Lever to fully open position at approximately 135°
- Rotate Load Plate to fully open position at approximately 100°
- Remove socket protective cover with left hand index finger and thumb to support the load plate edge, engage protective cover finger tab with right hand thumb and peel the cover from LGA775 Socket while pressing on center of protective cover to assist in removal.
- Set protective cover aside. Always put cover back on if the processor is removed from the socket.
- Visually inspect protective cover for damage. If damage observed, replace the cover. NOTE: After cover removal, make sure socket load plate and contacts are free of foreign material. Debris may be removed with compressed air.
NOTE: Removing protective cover after CPU insertion will compromise the ability to visually inspect socket.
- Visually inspect for bent contacts If any socket/motherboard mishandling is suspected, socket should be closely examined. Closing one eye, inspect socket contacts from different angles to find any damaged contacts. If any are found do not use motherboard. (Since these systems for the lab are non operational, you can use a damaged socket.)
Types Of Contact Damage to look for are: (See table 2 for potential causes and solutions)
| Contact is bent backwards upon itself Larger View > | Content is bent forward or downward Larger View > | Contact is bent sideways Larger View > | Content tip is missing or bent up Larger View > |
Table 2. Bent Contact Causes and Corrective Actions
| Failure Type | Potential Causes | Possible Corrective Action |
| 1,5 |
|
|
| 1,5 |
|
|
| 2 |
|
|
| 3 |
|
|
| 4 |
|
|
Processor Installation
As a supplement to the manual provided with the boxed processor, install the processor and fan heatsink in the following manner.
Do Not Touch Processor Contacts
Larger View >Processor Handling
- Open boxed processor packaging.
- Visually inspect to ensure processor protective cover is present and properly secured.
CAUTION: Recommend not to remove the processor protective cover. - CAUTION: DO NOT TOUCH PROCESSOR SENSITIVE CONTACTS AT ANY TIME DURING INSTALLATION.
- Lift processor package from shipping media by grasping the substrate edges ONLY.
NOTE: Orient processor package such that the Connection 1 triangle mark is on bottom left and both key notches are on left side. - Processor Protective Cover Handling: Remove protective cover with the opposite hand by depressing larger retention tab and peeling the cover away. (Figure 10)
- Set and reserve the protective cover aside. Always keep the protective side cover on the processor when not in the socket.
- Visually inspect the package gold pads:
Scan the processor package gold pad array for presence of foreign material. If necessary, the gold pads can be wiped cleaned with a soft lint free cloth and isopropyl alcohol (IPA). - Locate Connection 1 indicator and the two orientation key notches. (Figure 11)
- Grasp the processor with thumb and index finger. (Grasp the edges without the orientation notches.) The socket has cutouts for your fingers to fit into. (Figure12)
- Carefully place the package into the socket body using a purely vertical motion. (Tilting the processor into place or shifting it into place on the socket can damage the sensitive socket contacts.) (Figure 13)
CAUTION: Recommend not to use a Vacuum Pen for installation. - Verify that package is within the socket body and properly mated to the orientation keys.
- Close the socket by: (Figure 14)
- Close the Load Plate
- While pressing down lightly on Load Plate, engage the Load Lever.
- Secure Load Lever with Load Plate tab under retention tab of Load Lever
| Figure 10. Protective Cover Removal Larger View > | Figure 11. Larger View > | Figure 12. Larger View > |
| Figure 13. Larger View > | Figure 14. Larger View > |
NOTE: Glove images are for illustrative purposes only. Please consult local safety guidelines for specific requirements
NOTE: Recommend not to hold the load plate as a lever, instead hold at tab with left hand, removing the protective cover with right hand
Installing the Thermal Module Assembly
The Thermal Module Assembly (TMA) consists of 4 main parts:
- The 92mm 4-wire fan
- The plastic duct assembly (black)
- The heatsink (copper and aluminum)
- The metal retention clip (for holding the heatsink to the plastic duct assembly)
NOTE: The thermal solution integration procedures should be performed with the motherboard in the Chassis to provide proper clearance under the motherboard for the fastener mechanisms.
Step 1.- Install the motherboard into the chassis.
- Thermal Solutions that come with Intel® boxed processor use pre-applied thermal interface material (T.I.M.) and do not need grease. (figure 14)
CAUTION: Recommend not to touch or disturb the T.I.M. on the heatsink during installation. - Remove the thermal module from packaging media.
- Ensure that you do not pinch the wires under the duct assenmbly during installatiion. Figure 16 demonstrates proper routing as the wires exit the duct assembly.
- Notice in Figure 17 how the fan wires are improperly routed under the duct assembly and can be damaged when the assembly screws are tightened.
| Figure 15. Thermal interface material Larger View > | Figure 16. Proper cable routing Larger View > | Figure 17. Improper routing with pinched cables Larger View < |
- Install the thermal module assembly in the chassis by tightening the four supplied screws to the chassis.
- Ensure that your thermal module assembly creates a good seal to the chassis as seen in Figure 19. Your chassis may have a different interface than seen here, however, a good seal is important to provide proper airflow to the system.
- Notice how the seal is not tightly seated against the chassis in this example (Figure 20). This indicates that either the thermal module assembly is not correctly installed or the chassis is not built properly.
- Connect 4-wire fan cable to board CPU header. (Figure 21)
- Secure excess cable with tie-wrap to ensure cable does not interfere with fan operation or contact other components.
| Figure 18. Installing the thermal module assembly Larger View > | Figure 19. Proper installation with seal fully seated Larger View > | Figure 20. Improper seal against chassis vent Larger View > | Figure 21. Connecting the 4-wire fan cables Larger View > |
Top of Section > Table of Contents >
Section ContentsBoxed Processor Removal
Every time the thermal module assembly is removed from the processor, it is critical that the thermal interface material be replaced, in order to ensure proper thermal transfer to the boxed processor thermal module. Note: Be sure to take the proper electrostatic discharge (ESD) precautions (ground straps, gloves, ESD mats, or other protective measures) to avoid damaging the processor and other electrical components in the system.
Caution: If you find that considerable force is required to remove the boxed processor assembly, consider wearing gloves to protect your hands and take care to keep your hands away from any metal edges on the chassis when removing components.
Thermal Interface Material Attached to the Heatsink
Intel does not recommend the removal of the thermal interface material located on the bottom of the boxed processor fan heatsink. Removal of this material may cause damage to the processor and will void the boxed processor warranty. If you must remove and re-use the fan heatsink, it will require replacement. Also, if the thermal interface material is at all damaged, you must also replace the fan heatsink. Contact Intel Customer Support to receive a replacement fan heatsink.
Follow these steps to remove the boxed processor from the system:
- To open the socket
- Disengage the Load Lever
- Open the Load Plate
- Pick up FC-LGA4 processor package:
Note: You may use a vacuum pen to remove the processor.
By Hand: Grasp processor with index finger to hold the load plate hinge side and thumb to hold load lever side.
By Vacuum Pen: Place a minimum 9-mm cup at approximately the center of the Integrated Heat Spreader (IHS). The IHS is the metal portion on top of the processor.
NOTE: Do not place vacuum pen on IHS edge, due to risk of dropping processor and causing bent contacts.
Recommend not to use Vacuum Pen for inserting CPU - Lift the package straight up and away.
- Assemble processor's protective cover immediately to prevent contamination.
- While holding the processor by the three corners, with the other hand lift the processor cover by grasping at the large retention tabs. Ensure retention tabs and processor contacts are pointing each other.
- Orientate so the protective cover chamber is matching with package Connection 1 location.
- Hook the first large retention tab on the processor substrate. Then press the opposite tab onto the processor.
- Place processor with land side cover installed onto proper shipping media or other ESD approved work surface.
- Visually inspect socket contacts
- First Pass Inspection
- Scan socket contact array at varying angles noting the presence of any foreign material.
- If foreign material can’t be blown off by compressed air, or mechanical damage (Type 1 or 4. See 5 Types of Socket Contact Damage) observed, reject the motherboard for further evaluation or socket replacement.
- Second Pass Inspection
- Repeat 2 more times to sight down the rows and columns from each of the 4 sides of the socket to ensure all contacts within the array are inspected.
- Inspect for Type 2, Type 3, and Type 5 failures.
- First Pass Inspection
- Assemble LGA775 socket protective cover
- Hook protective cover back onto load plate, attaching bottom first, then clip thumb tab.
- Close the socket load plate and engage the load lever.
| Figure 22. Larger View > | Figure 23. Larger View > | Figure 24. Larger View > | |
| Figure 25. Larger View > | Figure 26. Larger View > |
Software and Operating System Considerations
The Pentium 4 Processor is a completely different micro-architecture from Intel's prior microprocessors that were based on the P6 micro-architecture. The Intel NetBurst micro-architecture supports the entire IA32 instruction set including Intel's MMX™ technology and the Streaming SIMD (Single Instruction Multiple Data) Extension. It also includes 144 more instructions called the Streaming SIMD Extensions 2 or SSE2. The SSE2 instructions compliment MMX technology and SSE instructions by supplying increased computation capability, support for larger data types (e.g. double-precision floating point numbers and 64-bit packed integer numbers), and several data handling and conversion instructions. In addition, the Intel NetBurst micro-architecture enhances the P6 micro-architecture's floating-point unit.
Processor manufactured on the 90nm and 65nm process technology included Streaming SIMD Extensions 3. These thirteen additional instructions have been added to the existing 144 instructions, including SIMD double precision floating-point, SIMD 128-bit integer, and cache and memory management instructions.SSE3 enhances performance to accelerate the most demanding aspects of Internet computing, as well as video, speech, encryption, imaging, and non-threaded workstation applications.
The Pentium 4 processor supporting Hyper-Threading Technology makes a single physical processor appear as two logical processors; the physical execution resources are shared and the architecture state (which tracks the flow of a program or thread) is duplicated for the two logical processors. For additional information on integrating systems based on the Pentium 4 processor supporting Hyper-Threading Technology, refer to the Integration Overview for Systems Based on the Intel Pentium 4 Processor Supporting Hyper-Threading Technology.
Operating System Support
Nearly all modern operating systems designed for the Intel Architecture have support for the Pentium 4 Processor, although some may require specific versions or processor support files. Microsoft* Windows* XP supports the Pentium 4 Processor. Additionaly, Linux* distributions based on the Linux* 2.4 core support the processor. Also, many other vendors have support for the Pentium 4 Processor in their operating systems. System integrators should verify that the operating system they have selected supports the Pentium 4 Processor.
Software Optimization
With specific drivers that use the SSE3 instructions, graphics accelerators, audio hardware and software, and other system resources can experience substantial performance gain. Graphics card vendors typically highlight support changes with new driver releases. Download and install the latest drivers from the vendor's website. Also, verify that the driver version contains optimization for the Pentium 4 Processor.
Hyper-Threading Technology increases processor utilization by executing more than one instruction thread at a time. This increased efficiency provides better responsiveness and immediate performance in multi-tasking environments and for multi-threaded applications. Download and install the latest drivers from the vendor's website. Also, verify that applications and driver versions contain optimizations for Hyper-Threading Technology for the Pentium 4 processor.
System performance is greatly affected by proper operating system and driver installation processes. For example, it is important to install the latest Intel® Chipset Software Installation Utility immediately after installing most Microsoft operating systems to ensure proper drivers for the chipset are installed prior to installation of other drivers. System integrators should confirm boxed Intel Pentium 4 processor-based systems are optimally configured and integrated.
Conclusion
Boxed Intel Pentium 4 processor-based systems require proper integration. System integrators that follow the guidelines in this document will experience higher customer satisfaction by providing higher quality systems.
2 Hyper-Threading Technology requires a computer system with an Intel® Pentium® 4 processor supporting HT Technology and a Hyper-Threading Technology enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. Performance will vary depending on the specific hardware and software you use. See www.intel.com/products/ht/hyperthreading_more.htm for more information including details on which processors support HT Technology.