Thermal Management for the Boxed Intel® Core™2 Extreme processor

Introduction
Thermal Management
Fan Heatsink
Thermal Interface Material Replacement for Fan Heatsink
Chassis Recommendations
Thermal Specifications

Introduction

This thermal guide covers thermal considerations for the boxed Intel® Core™2 Extreme processor.^Δ

Systems using Intel® Desktop processors all require thermal management. This document assumes a general knowledge of and experience with system operation, integration, and thermal management. Integrators who follow the recommendations presented can provide their customers with more reliable systems and will see fewer customers returning with thermal management issues. (The term "boxed Intel® processor" refers to processors packaged for use by system integrators.)

Thermal management in boxed Intel desktop processor-based systems can affect both the performance (Thermal Monitor feature) and noise level (variable speed fan) of the system.

The Intel Core 2 Extreme processor uses the Thermal Monitor feature to protect the processor during times where the silicon would otherwise operate above specification. See the datasheet for more information: Intel® Core™2 Extreme processor datasheet.

The feature is intended to help prevent long-term reliability damage to the processor and provide protection for unusual circumstances like higher than normal internal chassis temperatures (and inlet air temperature, defined as the air temperature entering the processor fan heatsink) or failure of a system thermal management component (such as a system fan). In its active state, the Thermal Monitor feature scales back processor power consumption, if the factory programmed thermal design temperature is exceeded (see Table 2 or the respective data sheet for complete thermal specifications). While the Thermal Monitor feature is active, the system's performance may drop below its normal peak performance level. It is critical that systems be designed to maintain low enough internal chassis and processor inlet air temperatures to prevent the boxed Intel desktop processor from entering a Thermal Monitor active state. In a properly thermal managed and designed system, the Thermal Monitor feature should never become active. It is recommended that the internal chassis temperature for boxed Intel Core 2 Extreme processor processor-based systems remain below 39C for nominal operating environments.

The Intel Core 2 Extreme processor fan heatsink has the fan thermistor disabled to allow maximum user flexibility. If the motherboard does not support 4-wire fan speed control the fan will spin at full speed. Two full speed options are supported (see figure 2). "Quiet Mode" limits fan speed to maintain maximum noise level below 35dBA. In "Quiet Mode" operation the fan heatsink will meet or exceed thermal performance required for operating the processor at its rated frequency. "Performance Mode" allows maximum user flexibility in overspeed environments by permitting increased fan speeds.

The thermal solution has a DIP switch mounted on the side of the fan heatsink (see figure 1) which can be used to change the fan heatsink between Quiet Mode and Performance Mode. The switch is set to Quiet Mode by default.

Figure 1.DIP Switch

The boxed Intel Core 2 Extreme processor fan heatsink supports motherboard based fan speed control technology to take advantage of the fact that the processor is not always running at its maximum power. This is done by basing the fan speed control on actual CPU temperature and power usage.

The speed of the new fan heatsink is controlled by the additional 4th wire of the fan cable. (The technology is sometimes referred to as “4-wire fan speed control”.)

The additional 4th wire sends a signal from the motherboard to the fan heatsink to control its speed. There is a thermal diode in the processor which measures actual CPU temperature. The processor sends information to the motherboard about its specific thermal requirements and the actual processor temperature. The motherboard then uses this information to optimally control the speed of the processor fan.

Figure 2 shows the fan speed operation. The red line represents the maximum fan speed for "Performance Mode." The green line shows maximum fan speed for Quiet mode. The additional curves in blue represent fan operations at lower CPU temperature and power consumption levels based on the 4-wire fan speed control. If the motherboard based fan speed control is disabled or working improperly the fan will run at the maximum speed for Performance Mode or Quiet Mode respectively. Contact your motherboard manufacture to ensure 4-wire fan speed control is enabled.

Figure 2.Operation Of Boxed Processor Fan Heatsink

NOTE: The acoustic benefits of the 4-wire based fan speed control may vary depending on the specific motherboard implementation. (The acoustic benefits are reliant on the motherboard implementation of fan speed control.)

Intel has recently developed a revolutionary motherboard based fan speed control included with Intel chipset based motherboards called Intel® Quiet System Technology (Intel® QST). This new technology uses a PID controller that can measure the rate of change of the processor temperature, thus predicting when the processor will reach its maximum temperature. If implemented correctly by the motherboard manufacturer, the control algorithm will operate the processor fan at minimum speed under most operating conditions. Since Intel® QST can predict when the processor will reach its maximum temperature, it will delay increasing the fan speed until just the right moment in order to keep the processor from exceeding its maximum temperature. Consult your motherboard manufacturer to see which motherboards they offer with support for Intel® QST.

A 4-wire fan does not guarantee a quieter system. If the processor is being used in a hot environment and under heavy loads, the fan will have to run fast enough to properly cool the processor. The internal chassis temperature is required to be maintained at 39°C or lower.

Allowing processors to operate at temperatures beyond their maximum specified operating temperature may shorten the life of the processor and can cause unreliable operation. Meeting the processor's temperature specification is ultimately the responsibility of the system integrator. When building quality systems using the boxed Intel processor, it is imperative to carefully consider the thermal management of the system and verify the system design with thermal testing. This document details specific thermal requirements of the boxed Intel Core 2 Extreme processor. System integrators using the boxed Intel Core 2 Extreme processor should become familiar with this document as well as the two related documents listed below.

Related Documents

1. System Thermal Management for Boxed Intel Processor-Based Desktop PCs
   
   This document details general recommendations for improving system thermal management in desktop systems that use boxed Intel processors.
2. Thermal Testing with Thermocouples and Thermal Meters on Intel Boxed Processor-Based Desktop PCs
   
   This document describes the use of thermocouples and thermal meters for testing Intel boxed processor-based desktop systems. Thermocouples can be used to test temperatures critical to the proper operation of boxed processors. The document also discusses what software to use when performing thermal testing.

Thermal Management

Proper "thermal management" depends on two major elements: a heatsink properly mounted to the processor, and effective airflow through the system chassis. The ultimate goal of thermal management is to keep the processor at or below its maximum operating temperature.

Proper thermal management is achieved when heat is transferred from the processor to the system air, which is then vented out of the system. Boxed Intel processors are shipped with a high-quality variable speed fan heatsink, which can effectively transfer processor heat to the system air. It is the responsibility of the system integrator to ensure adequate system airflow.

Fan Heatsink

The fan heatsink included with the boxed Intel processor must be securely attached to the processor. Thermal interface material (preapplied attached to the bottom of the heatsink) provides effective heat transfer from the processor to the fan heatsink. The fan cable provides power to the fan by connecting to a motherboard-mounted power header and also allows the transfer of information to and from the fan with the motherboard.

The fan is a high-quality ball bearing fan that provides a good local air stream. This air stream transfers heat from the heatsink to the air inside the system. However, moving heat to the system air is only half the task. Sufficient system airflow is also needed in order to exhaust the air. Without a steady stream of air through the system, the fan heatsink will re-circulate warm air, and therefore may not cool the processor adequately.

Thermal Interface Material Replacement for Fan Heatsink

Chassis Recommendations

Systems based on the boxed Intel desktop processor must use a chassis that comply with the ATX specification (revision 2.2 or later) or microATX specification (revision 1.0 or later), depending on the motherboard form factor. Intel recommends system integrators using ATX form factor motherboards to choose a chassis that complies with the ATX specification (revision 2.2 or later). Likewise, system integrators using microATX form factor motherboards should choose a chassis that complies with the microATX specification (1.0 or later).

The chassis must also support a lower internal ambient temperature than many standard ATX and microATX desktop chassis. The internal chassis temperature for systems based on the boxed Intel® Core™2 Extreme processor should not exceed 39°C when the chassis is used in a maximum expected room temperature of 35°C. Most chassis designed for the boxed Intel desktop processor use extra internal chassis fans to improve airflow and many include ducting to bring cool air directly to the processor fan heatsink. A 39°C internal chassis temperature is best achieved by using a Thermally Advantaged Chassis (TAC) version 1.1.

It is recommended to use a Thermally Advantaged Chassis on the Tested Chassis List to ensure proper chassis airflow, electrical support (ATX12V or SFX12V power supply), and compatibility with boxed Intel processors. Chassis that pass this thermal testing provide system integrators with a starting place for determining which chassis to evaluate. It is strongly recommended that system integrators perform thermal testing on the chassis selected for each system configuration, even when using a chassis on the tested chassis list.

Intel® Desktop Processor Thermal Specifications

Table 2 lists the power dissipation of boxed desktop processors at various processor numbers. Also see the following documents for more details on processor power specifications:
Intel® Core™2 Extreme processor datasheet.

System integrators can perform thermal testing using thermocouples to determine the temperature of the processor's integrated heat spreader (see Intel® Core™2 Duo processor Thermal Design Guidelines, for details) or the temperature of the air entering the boxed processor fan heatsink inlet (see Thermal Testing with Thermocouples and Thermal Meters on Intel Boxed Processor-Based Desktop PCs).

A simple evaluation of the temperature of the air entering the fan heatsink can provide confidence in the system's thermal management. For boxed Intel processors, the testing point is at the center of the fan hub, approximately 0.3 inches above the fan. Evaluation of test data makes it possible to determine if a system has sufficient thermal management for the boxed processor. Systems based on the boxed Intel Core 2 Extreme processor should have a maximum expected temperature of 39°C in the maximum expected external ambient (which is typically 35°C). This is best achieved by using a Thermally Advantaged Chassis.

Table 2. Boxed Intel® Processor Thermal Specifications

Notes:

1. These specifications are from the Intel® Core™2 Extreme Processor.

Δ Not all Intel® Boxed Processors include a fan heatsink solution in the package.