Video: Learn more about new Intel® Thermal Solutions (ZIP 27.3MB)
Boxed processor change for Intel® Xeon® processor 5500 series
To offer more purchasing flexibility and reduce waste and cost for customers with other sources for heat sinks, the Intel® Xeon® processor 5500 series no longer includes a heat sink in the box. The boxed Intel® Thermal Solution STS100 series is available through the same distributors and offers the same three-year limited warranty as boxed processors.
This change applies only to processors for server/workstation systems with two LGA1366 sockets. The Intel® Xeon® processor 3500 series includes a heat sink for single-socket systems in the box.
Understanding the Intel® Thermal Solution changes
System integrator impact
- Intel Xeon processor 5500 series boxed processors are shipping without heat sinks in the boxes
- Intel is offering the boxed Intel® Thermal Solution STS100 series to support the Intel Xeon processor 5500 series
- These all-new heat sink designs are not compatible with previous generation server platforms
- Boxed processors and thermal solutions are available in single-pack boxes from Intel® Authorized Distributors
- Check with your chassis supplier for details on choosing the correct heat sink
- If you choose to use a third-party thermal solution, it must meet the processor cooling specifications to qualify for processor warranty1 support
1Boxed processors have a three-year limited warranty. Tray processors using the Intel® Thermal Solution have a one-year limited warranty.
Quick reference guide
| Intel® Thermal Solution STS100 Series for Intel® Xeon® processors in server/workstation systems featuring two LGA1366 sockets | |||
| Product name | Intel® Thermal Solution STS100C | Intel® Thermal Solution STS100A | Intel® Thermal Solution STS100P |
| Description | Passive/active combination heat sink with removable fan | Active heat sink with fixed fan | 25.5mm tall passive heat sink |
| Recommended usage2 | With fan installed: With fan removed: | Pedestal chassis that provides ventilation and correct temperature air to heat sink | 1U or 2U rack and blade chassis with ducted airflow to heat sink |
| Maximum CPU TDP | 130W | 80W | 95W |
| Boxed product code | BXSTS100C | BXSTS100A | BXSTS100P |
| 2Contact your chassis supplier for compatibility details. | |||
Download PDF version of thermal solution table for reference.