The following overview and installation instructions are for professional system integrators building ATX form factor PCs that use Boxed Intel® processors in the 775-land package with industry-accepted motherboards, chassis, and peripherals. It contains technical information intended to aid in system integration. An integration video is also available to help system integrators accuratley build systems based on boxed Intel processors.
Mother Board Handling
- Remove Motherboard from ESD bag (if applicable)
- Visually inspect to ensure socket load lever and load plate are secured CAUTION: Recomend not to open the socket at this time.
- Visually inspect to ensure socket protective cover is present and properly secured
CAUTION: Recommend not to remove the socket protective cover - CAUTION: DO NOT TOUCH SOCKET SENSITIVE CONTACTS
| 
Figure 5: Do NoTouch Socket Contacts
|
Socket Preparation
- Opening the socket: Note: Apply pressure to the corner with right hand thumb while opening/closing the load lever, otherwise lever can bounce back like a “mouse trap” and WILL cause bent contacts (when loaded)
- Disengage Load Lever by depressing down and out on the hook to clear retention tab
- Rotate Load Lever to fully open position at approximately 135°
- Rotate Load Plate to fully open position at approximately 100°
- Remove Socket Protective Cover
With left hand index finger and thumb to support the load plate edge, engage protective cover finger tab with right hand thumb and peel the cover from LGA775 Socket while pressing on center of protective cover to assist in removal.
- Set protective cover aside. Always put cover back on if the processor is removed from the socket.
- Visually inspect protective cover for damage. If damage observed, replace the cover.
NOTE: After cover removal, make sure socket load plate and contacts are free of foreign material. Debris may be removed with compressed air. NOTE: Removing protective cover after CPU insertion will compromise the ability to visually inspect socket.
- Visually inspect for bent contacts
If any socket/motherboard mishandling is suspected, socket should be closely examined.
Closing one eye, inspect socket contacts from different angles to find any damaged contacts. If any are found do not use motherboard. (Since these systems for the lab are non operational, you can use a damaged socket.)
| Figure 6: Opening the Socket

Figure 7: Remove Protective Cover

NOTE: Glove images are for illustrative purposes only. Please consult local safety guidelines for specific requirements NOTE: Recommend not to hold the load plate as a lever, instead hold at tab with left hand, removing the protective cover with right hand
|
5 Types Of Contact Damage to look for are:
(See table 2 for potential causes and solutions)
1. Contact is bent backwards upon itself
 | 2. Content is bent forward or downward

|
3. Contact is bent sideways
 | 4. Content tip is bent up
5. Content tip is missing

|
Table 2: Bent Contact Causes and Corrective Actions
FailureType
| Potential Causes | Possible Corrective Action |
| 1,5 | • CPU Tilted during installation or removal
• Glove/finger snag | • Verify CPUs are installed and removed vertically ONLY
– Vacuum wands may be considered
• Verify CPUs are being held by the substrate edge ONLY
|
| 1,5 | • Glove/finger snag
• CPU Capacitors dragging | • Verify Packages are held by substrate edges ONLY
• Verify CPUs are lifted and placed vertically ONLY
– Vacuum wands may be considered |
| 2 | • CPU Tilted during installation or removal
• CPU dragged across contacts during installation or removal
• CPU dropped during installation or removal
• Socket Protective cover dropped into socket | • Verify Packages are held by substrate edges ONLY
• Verify CPUs are lifted and placed vertically ONLY
– Vacuum wands may be considered |
| 3 | • CPU tilted during installation or removal
• CPU dragged across contact array
• Glove/finger snag | • Verify Packages are held by substrate edges ONLY
• Verify CPUs are lifted and places vertically ONLY
– Vacuum wands may be considered |
| 4 | • Socket supplier defect
• Glove/finger snag
• CPU Capacitors draggin | • Return motherboard to manufacture
• Verify Packages are held by substrate edges ONLY
• Verify CPUs are lifted and places vertically ONLY
– Vacuum wands may be considered |
Boxed Processor Installation
As a supplement to the manual provided with the boxed processor, install the processor and fan heatsink in the following manner.
Processor Handling
- Open boxed processor packaging.
- Visually inspect to ensure processor protective cover is present and properly secured
CAUTION: Recommend not to remove the processor protective cover - CAUTION: DO NOT TOUCH PROCESSOR SENSITIVE CONTACTS AT ANY TIME DURING INSTALLATION.
| 
Do NoTouch Processor Contacts
|
Processor Installation
- Lift processr package from shipping media by grasping the substrate edges ONLY.
NOTE: Orient processor package such that the Connection 1 triangle mark is on bottom left and both key notches are on left side - Processor Protective Cover Handling: Remove protective cover with the opposite hand by depressing larger retention tab and peeling the cover away (figure 8)
- Set and reserve the protective cover aside. Always keep the protective side cover on the processor when not in the socket.
- Visually inspect the package gold pads:
Scan the processor package gold pad array for presence of foreign material. If necessary, the gold pads can be wiped cleaned with a soft lint free cloth and isopropyl alcohol (IPA).
- Locate Connection 1 indicator and the two orientation key notches. (Figure9)
- Grasp the processor with thumb and index finger. (Grasp the edges without the orientation notches.) The socket has cutouts for your fingers to fit into. (FIgure10)
- Carefully place the package into the socket body using a purely vertical motion. (Tilting the processor into place or shifting it into place on the socket can damage the sensitive socket contacts.) (Figure11)
CAUTION: Recommend not to use a Vacuum Pen for installation. - Verify that package is within the socket body and properly mated to the orientation keys
- (Figure12) Close the socket by
- Close the Load Plate
- While pressing down lightly on Load Plate, engage the Load Lever.
- Secure Load Lever with Load Plate tab under retention tab of Load Lever
| Figure 8 Protective Cover Removal

Figure 9

Figure 10
Figure 11
Figure 12
|
Boxed Intel Fan Heatsink Handling
- To prevent damage, avoid setting the thermal solution with the prongs down
- Set on heatsink side or with fan down
| Figure 13

|
Boxed Fan Heatsking Installation
NOTE: The thermal solution integration procedures should be performed with the motherboard in the Chassis to provide proper clearance under the motherboard for the fastener mechanisms.
- Install the motherboard into the chassis.
- Thermal Solutions that come with Intel® boxed processor use pre-applied thermal interface material (TIM) and do not need grease. (figure 14)
CAUTION: Recommend not to touch or disturb the T.I.M. on the heatsink during installation. If the TIM is disturbed contact Intel Customer Support for replacement TIM. - Remove Heat Sink (HS) from packaging media.
- Place HS onto the LGA775 Socket. (Figure 15)
- Ensure fan cables are oriented on side closest to fan header.
- Align Fasteners with MB through-holes.
- Make sure fasterns are flush with motherboard (Figure 16)
- Inspection
- Ensure cables are not trapped or interfere fastener operation.
- Ensure fastener slots are pointing perpendicular to Heat Sink. (Figure 15)
- Actuate fasteners (Figure 17)
- While holding HS to prevent tilting, press down on fastener caps with thumb to install and lock.
- Repeat with remaining fasteners.
- Inspection (Figure 18)
- Verify the fasteners are properly seated by pulling up on each fastener.
- Ensure both fastener cap and base are flush with spring and motherboard.
- Connect fan cable to Board CPU header. (Figure 19)
- Secure excess cable with tie-wrap to ensure cable does not interfere with fan operation or contact other components.
| Figure 14![]()
Figure 15
Figure 16

Figure 17
Figure 18

Figure 19

|
Maintaining and Upgrading Systems Based on the Pentium D Processors in the 775-land Package
Boxed Processor Removal
Every time the heatsink is removed from the processor, it is critical that the thermal interface material be replaced, in order to ensure proper thermal transfer to the boxed processor fan heatsink. Note: Be sure to take the proper electrostatic discharge (ESD) precautions (ground straps, gloves, ESD mats, or other protective measures) to avoid damaging the processor and other electrical components in the system.
Caution: If you find that considerable force is required to remove the boxed processor assembly, consider wearing gloves to protect your hands and take care to keep your hands away from any metal edges on the chassis when removing components.
Thermal Interface Material Attached to the Heatsink
Intel does not recommend the removal of the thermal interface material located on the bottom of the boxed processor fan heatsink. Removal of this material may cause damage to the processor and will void the boxed processor warranty. If you must remove and re-use the fan heatsink, it will require replacement. Also, if the thermal interface material is at all damaged, you must also replace the fan heatsink. Contact Intel Customer Support to receive a replacement fan heatsink.
Removal InstructionsFollow these steps to remove the boxed processor fan heatsink from the system:
- Disconnect fan cable from motherboard header
- Turn fastener caps (1) counter-clock wise 90° to the un-locked position (Figure 20) (You may need to use a flathead screwdriver to unlock the fasteners)
NOTE:Do not over rotate the fasteners. - Pull up on fastener caps to unseat (Figure 20)
- Manually remove heatsink with gentle twisting motion.
- To re-assemble the heatsink, reset the fastener caps to their original position with the slot perpendicular to the heatsink. Re-attach cable to cable management clips. Then, follow the assembly instructions.
| Figure 20

Figure 21

|
Follow these steps to remove the boxed processor fan heatsink from the system:
- To open the socket
- Disengage the Load Lever
- Open the Load Plate
- Pick up FC-LGA4 processor package:
Note: You may use a vacuum pen to remove the processor. By Hand: Grasp processor with Index finger to hold the load plate hinge side and thumb to hold load lever side. By Vacuum Pen: Place a minimum 9-mm cup at approximately the center of the Integrated Heat Spreader (IHS). The IHS is the metal portion on top of the processor.) NOTE: Do not place vacuum pen on IHS edge, due to risk of dropping processor and causing bent contacts. Recommend not to use Vacuum Pen for inserting CPU - Lift the package straight up and away.
- Assemble processors protective cover immediately to prevent contamination.
- While holding the processor by the 3 corners, with the other hand lift the processor cover from work surface by grasping at the large retention tabs. Ensure retention tabs and processor contacts are pointing each other.
- Orientate so the protective cover chamfer is matching with package Connection 1 location.
- Hook the first large retention tab on the processor substrate. Then press the opposite tab onto the processor
- Place processor with land side cover installed onto proper shipping media or other ESD approved work surface
- Visually inspect socket contacts
- First Pass Inspection
- Scan socket contact array at varying angles noting the presence of any foreign material
- If foreign material can’t be blown off by compressed air, or mechanical damage (Type 1 or 4. See 5 Types of Socket Contact Damage) observed, reject the motherboard for further evaluation or socket replacement.
- Second Pass Inspection
- Repeat 2 more times to sight down the rows and columns from each of the 4 sides of the socket to ensure all contacts within the array are inspected
- Inspect for Type 2, Type 3, and Type 5 failures
- Assemble LGA775 socket protective cover
- Hook protective cover back onto load plate, attaching bottom first, then clip thumb tab.
- Close the Socket load plate and engage the load lever.
| Figure 22
Figure 23
Figure 24 Figure 25

Figure 26

|
Copyright © 2006 Intel Corporation. All rights reserved. Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
**Other names and brands may be claimed as the property of others.