The Boxed Intel® Pentium® D Processor in the 775-Land Package
The following overview and installation instructions are for professional system integrators building PCs that use Intel® Pentium® D processors in the 775-land package with industry-accepted motherboards, chassis, and peripherals. It contains technical information intended to aid in system integration. Boxed Intel Pentium D processor product information can also be found in the processor Product Brief, Frequently Asked Questions, and Selling Guide for the Pentium D processor. (The term "Pentium D processors in the 775-land package" refers to Pentium D processors in the Flip-Chip Land Grid Array (FC-LGA4) package.) Access Platform Compatibility Guide information here.
Table of Contents
The Boxed Intel® Pentium® D Processor in the 775-Land Package- Processor Overview
- Boxed Processor Contents
- Intel® Pentium® D Processor in the 775-land FC-LGA4 Package
- Identifying a Boxed Processor
- Boxed Processor Installation
- Maintaining and Upgrading Systems Based on Intel Pentium D Processors in the 775-Land Package
- Boxed Processor Removal
- Software and Operating System Considerations
- Operating System Support
- Software Optimization
Section Contents Intel® Pentium® D Processor in the 775-land FC-LGA4
Package >
The Intel Pentium D processor includes several new performance enhancing features.
Dual-core:
The Power of dual-core delivers exceptional benefits to your platform: Intel dual-core processors have two complete execution cores in one processor package running at the same frequency. The two physical cores in one package have their own set of registers and cache.Level 1 Execution Trace Cache:
The Intel Pentium D processor features two 16KB data caches. In addition to the data cache, each core includes an execution trace cache that stores up to 12K decoded micro-ops in the order of program execution. This increases performance by removing the decoder from the main execution loop and makes more efficient usage of the cache storage space since instructions that are branched around are not stored.4MB Level 2 Cache:
The Intel Pentium D procesor based on 65nm technology consists of 2MB L2 Advanced Transfer Cache for each core (4MB total) enabling improved overall system performance by allowing each processor core to have faster access to larger amounts of the most often used data. The Intel Pentium D processor based upon Intel 90nm process technology has a 1MB L2 Advanced Transfer Cache for each core (2MB total).Intel® SpeedStep® Technology (EIST):
Intel® Enhanced Intel Speedstep Technology (EIST) allows the system to dynamically adjust processor voltage and core frequency, which can result in decreased average power consumption and decreased average heat production. Combined with existing power saving features, EIST may provide an excellent balance between providing power when you need it and conserving it when you don't. This feature only available on certain Intel processors. See the Processor Spec Finder at processorfinder.intel.com or contact your Intel representative for more information. See the EIST How To document for specific requirements and integration procedures.Intel® 645:
Intel® 64 provides an enhancement to Intel 32-bit architecture by enabling the desktop processor platform to access larger amounts of memory. With appropriate 64-bit supporting hardware and software, platforms based on an Intel processor supporting Intel 64 can enable use of extended virtual and physical memory. See the Intel® 64 How to document for specific requirements and integration procedures.Execute Disable Bit4:
This feature, combined with a supported operating system, allows memory to be marked as executable or non-executable. If code attempts to run in non-executable memory the processor raises an error to the operating system.Streaming SIMD Extensions 3:
Single Instruction Multiple Data Extensions significantly accelerate performance of 3-D graphics and include additional integer and cache ability instructions that improve other aspects of performance.65nm Process Technology:
The 65nm process technology is the latest in Intel manufacturing and technology providing industry-leading density, performance and power reduction features. Intel's leading strained silicon technology, first implemented in 90-nm process technology is further enhanced in the 65nm technology.90nm Process Technology:
The 90nm process technology is the previous generation technology in Intel manufacturing and technology leadership allowing for transistor advantages such as strained silicon lattice to deliver faster transistors and potentially increase performance.Hyper-Threading Technology2 (HT Technology):
In addition to the above features the Intel Pentium processor Extreme Edition supports HT Technology. In desktop PCs and entry-level workstations, HT Technology takes advantage of threaded applications already in the market, and will deliver benefits from the next generation multi-threaded software applications. Multithreaded software divides workloads into processes and software threads that can be independently scheduled and dispatched.Intel® Viiv™ Technology:
Intel Pentium D processors support Viiv technology. Intel Viiv technology is designed to enrich consumers' enjoymnet of digital enterainment. PCs based on Intel Viiv technology will be easy to use with a remote control and will be powered by a suite of Intel technologies including a dual-core processor, chipset, platform software and wired networking capabilities.
Intel dual-core processors provide two execution cores in one physical processor allowing the platform to do more in less time while enjoying smooth interaction with your PC.
Included with the Boxed Intel® Pentium® D Processor in the 775-land Package
- Intel® Pentium® D processor in the 775-land package
- Intel Designed Thermal Solution (includes high quality variable speed fan heatsink and attachment assembly)
- Thermal interface material (attached to the heatsink)
- Installation Instructions and Certificate of Authenticity
- Intel Inside® logo label
The Pentium D processor in the 775-land package refers to Pentium D processors in the 775-land Flip-Chip Land Grid Array (FC-LGA4) package with an Integrated Heat Spreader (IHS) that aids in heat dissipation to a properly attached fan heatsink.
Intel® Pentium® D Processor in the 775-land FC-LGA4 PackageFigure 1.
Top View
Bottom View
As processor power has increased, required thermal solutions have generated more noise. Intel has added an option to the boxed processor that allows system integrators to have a quieter system in the most common usage.
Previous generation boxed Intel fan heatsinks contain built in circuitry to control fan speed. They have a thermistor in the fan hub which measures the chassis ambient air temperature. The fan circuitry then adjusts the fan speed to properly cool the processor at the slowest speed allowable. If the chassis ambient temperature is cool then the fan will run slower and quieter. If the ambient temperature is hot, then the fan will run faster.
This fan was designed to work in a variety of operating conditions so it had to be designed in such a way that it would cool the processor when running at its maximum power at any given ambient temperature (up to 39C). In normal operating environments the processor is running at its maximum power only a fraction of the time.
Under most conditions the fan is spinning faster and louder than necessary. (The fan heatsink is required to work this way so that it will properly cool the CPU in all specified operating environments.)
Intel has been aware of customer concerns over increasing fan noise. Intel has now designed a new fan speed control technology to take advantage of the fact that the processor is not always running at its maximum power. This was done by basing the fan speed control on actual CPU temperature and power usage.
The speed of the new fan heatsink is controlled by the additional 4th wire of the fan cable. (The new technology is sometimes referred to as "wire fan speed control".)
The additional 4th wire sends a signal from the motherboard to the fan heatsink to control its speed. There is a thermal diode in the processor which measures actual CPU temperature. The processor sends information to the motherboard about its specific thermal requirements and the actual processor temperature. The motherboard then uses this information to optimally control the speed of the processor fan.
Figure 2 shows the current fan speed curve (Red) of a 3-wire, fan heatsink-thermistor based fan speed control. The additional curves in blue represent fan operations at lower CPU temperature and power consumption levels based on the 4-wire fan speed control fan heatsink.
The Max Temp in figure 2 represents the upper set point or worse case ambient temperature of 39C. The Min Temp represents the lower set point or the slowest possible fan speed at an ambient temperature of 30C. (Also see Table 1)
The acoustic benefits of the 4-wire based fan speed control may vary depending on the specific motherboard implementation. (The acoustic benefits are reliant on the motherboard design.)
If the new 4-pin active fan heat sink solution is connected to an older 3-pin motherboard
CPU fan header it will default back to a fan heatsink thermistor controlled mode, allowing compatibility with existing 3-pin motherboard designs. The fan heatsink has onboard circuitry that will control the fan speed based on internal chassis ambient temperature.
A 4-wire fan does not guarantee a quieter system. If the processor is being used in a hot environment and under heavy loads the fan will have to run fast enough to properly cool the processor. The internal chassis temperature is required to be maintained at 39C (or lower). Selecting the correct chassis (see Chassis Selection) and verifying proper thermal management is critical for integrating a high quality boxed Intel Pentium D processor-based system (see Thermal Management for Boxed Intel Pentium D Processor-Based Systems)
Table 1. Boxed Processor Variable Fan Heatsink Set Points
| For Boxed Intel® Pentium® D Processors in the 775-land package | |
| Internal Chassis Temperature (°C) | Boxed Processor Fan Heatsink Set Points |
X <= 301 | Lower Set Point: Fan speed constant at lowest fan speed. Recommended temperature for nominal operating environment. |
Y = 35 | Recommended maximum internal chassis temperature for boxed Intel Pentium D processor-based systems. |
Z >= 391 | Higher Set Point: Fan speed constant at highest fan speed. |
1 Set point variance is approximately ±1°C from fan heatsink to fan heatsink.
Figure 2. Internal Chassis Temperature Affect On Boxed Processor Variable Speed Fan Heatsink Noise
Identifying a Boxed Processor
Boxed processor test specifications (or S-Specs) marked on the integrated heat spreader of the Pentium D Processor identify specific information about the processor. Using the S-Spec Reference Table or the Processor Spec Finder and the information marked on the processor, a system integrator can verify the appropriate processor number, speed rating, stepping, lot number, serial number and other important information about the processor. The numbers marked on the processor should match the numbers on the processor box label (see Figure 3).
Figure 3. Processor Box Label
Larger View >
Once the boxed processor is installed into a system, the fan heatsink covers the integrated heat spreader and all the markings on the processor. The label on the box of the boxed processor (that has the processor number, speed information, test specification, and lot number) should be photo copied and taped to the inside of the chassis for reference. This will allow quick access to the information that is no longer available on the top of the processor when the heatsink is installed. If a system's processor is later upgraded or replaced causing the photocopied information inside the chassis to have incorrect information, the photocopy should be replaced, removed or visibly marked as obsolete to avoid confusion.
Top of Section > Table of Contents >
Section ContentsPlatform Component Selection
Motherboard Selection
Motherboards used with the Pentium D processor in the 775-land package must specifically support the Intel NetBurst micro-architecture 800MHz system bus. Also, the Pentium D processor in the 775-land package must be used in a motherboard with a Land Grid Array 775 (LGA775) socket. It is important to verify that the specific motherboard model and revision support the specific Pentium D Processor number being used. Motherboards may also require a BIOS update in order to support specific processors.
Motherboards that support the Pentium D processor and are based on the ATX form factor specification utilize power supplies that follow the ATX12V power supply design guide. Similarly, microATX form factor motherboards that support the Pentium D processor utilize power supplies that follow the ATX12V or SFX12V power supply design guides. Both the ATX12V and SFX12V power supply design guides are available on the Form Factors website.
Platform Compatibility Guide
To reduce confusion in proper motherboard selection, Intel has created a compatibility naming convention called, Platform Compatibility Guide. "05B" and "05A" will be the first Platform Compatibility Guides for the Pentium D processor. (Future specifications will use similar Platform Capability Guides where the first two digits represent the year the Guide is introduced and the 3rd digit stands for the market segment. "A" applies to processors that fall in the Mainstream 2, 1 and Value market segments; where "B" applies to processors that fall in the Performance and Mainstream 3 market segments. Intel product dealers can view the Desktop Processor Roadmap (PDF) which shows which processors fall under the various market segments. Additionally, Platform Compatibility Guide information for a specific processor can be found on the S-Spec Reference Table and the Processor Spec Finder)
All of the Boxed Intel® Pentium® D processors in the FC-LGA4 package will have markings on the box with either, "Platform Compatibility 05B" or "Platform Compatibility 05A". See figure 4 for an example of how processors will be marked.
Motherboards that support processors with the Platform Compatibility Guide (PCG) 05B specification will support processors with the PCG 05B and 05A. In other words Motherboards designed to PCG 054B are backwards compatible with 05A processors. Motherboards that only support processors with the PCG 05A will not support PCG 05B processors. These motherboards have been designed to provide customers with a lower cost platform.
Platform Compatibility Guides do not promise compatibility. Platform Compatibility Guides specify likely motherboard compatibility with processor electrical requirements. Compatible BIOS, drivers, hardware, and operating system are required.
Additionally, a BIOS upgrade may be required in order to properly recognize and initialize the latest stepping of the Pentium D processor. Motherboards must also meet the electrical and mechanical specifications of the Pentium D processor, as documented in the Datasheet. Intel tests motherboards for basic compatibility and lists passing boards on the Tested Motherboard List for the Boxed Intel Pentium D processor.
Figure 4. Platform Compatibility Guide Location On BoxLarger View >
Motherboard Compatibility for Intel® Pentium® D Processors :
Ensure that you are using a motherboard that is compatible with the Pentium D processor with a dual coare. Enabling dual core functionality for your system requires a Pentium D processor , a motherboard that supports the Pentium D processor, and an operating system that includes optimizations for dual core (Windows* Vista* or Windows* XP or certain versions of Linux*). Intel provides a Tested Motherboard List and The Source Motherboard List for your convenience in choosing a suitable motherboard. Also see Table 2 below for chipset support requirements.
Motherboard Compatibility for Intel® Pentium® D Processors with 65nm technology:
Support of these processors may require a BIOS update.
Motherboard Compatibility for Intel® Pentium® D Processors with suppport for Enhanced Intel SpeedStep® technology (EIST):
See the EIST How To document for specific requirements and integration procedures.
Motherboard Compatibility for Intel® Pentium® D Processors with suppport for Intel® 64:
See the Intel® 64 How to document for specific requirements and integration procedures.
Motherboard Compatibility for the Intel® Pentium® processor with HT Technology2 Extreme Edition:
Ensure that you are using a motherboard that is compatible with the Pentium processor with Hyper-Threading Technology Extreme Edition in the 775-land package. Enabling HT Technology functionality for your system requires a Pentium processor supporting HT Technology, a motherboard that supports HT Technology (a BIOS upgrade may be required in order to enable HT Technology support), and an operating system that includes optimizations for HT Technology (Windows* Vista* or Windows* XP or certain versions of Linux*). Consult your motherboard manufacturer for compatibility.
The Pentium processor with Hyper-Threading Technology Extreme Edition in the 775-land package requires a motherboard that meets more stringent electrical requirements. Specifically you motherboard must have an additional 2x4 power connector. Consult your motherboard manufacturer for compatibility.
Fan Heatsink Support
The boxed processor includes a high quality unattached fan heatsink specifically designed to provide sufficient cooling to the Pentium D Processor when used in a suitable chassis environment. The fan power cable must be connected to the motherboard power header as shown in the processor installation notes (included in the boxed processor package).
The motherboard 4-pin header uses two pins to supply +12V (power) and GND (ground). The fan uses the third pin to transmit fan-speed information to motherboards. The fourth pin allows motherboards that support 4-wire fan-speed control to control the fan speed based on actual processor power consumption. The 4-pin connector is keyed to be backwards compatible with a 3-pin motherboard header. The motherboard must have a 4-pin or 3-pin fan power header located close to the socket.
Note: Refer to your motherboard manual for the location of the CPU fan power header.
See the Thermal Management for Boxed Intel Pentium D Processor-Based Systems document for more details on the benefits of 4-wire fan-speed control. Also see the Tested Motherboard List for boards that have been tested to meet the requirements for proper 4-wire fan-speed control. Motherboards passing this test will control the boxed Intel processor fan heatsink according to processor thermal and acoustic requirements.
Chassis Selection
Systems based on the Pentium D processor in the 775-land package must use a chassis that comply with the ATX specification (revision 2.01 or later) or microATX specification (revision 1.0 or later), depending on the motherboard form factor. Intel recommends system integrators using ATX form factor motherboards to choose a chassis that complies with the ATX specification (revision 2.01 or later). Likewise, system integrators using microATX form factor motherboards should choose a chassis that complies with the microATX specification (1.0 or later).
It is recommended to use a chassis on the Tested Chassis List to ensure proper chassis airflow, electrical support (ATX12V or SFX12V power supply), and compatibility with boxed Intel Pentium 4 processors using an Intel® Desktop Board. Chassis that pass this thermal testing provide system integrators with a starting place for determining which chassis to evaluate.
The chassis must also support a lower internal ambient temperature than many standard ATX and microATX desktop chassis. The internal chassis temperature for systems based on Pentium D processors in the 775-land package should not exceed 39C when the chassis is used in a maximum expected room temperature of 35C. Most chassis designed for the Pentium D Processor use extra internal chassis fans to improve airflow and many include ducting to bring cool air directly to the processor fan heatsink. Intel tests chassis with the boxed Intel Pentium D Processor and the Intel® Desktop Boards for minimum thermal requirements. These chassis meet Intel's processor specifications with the Intel Desktop Boards. It is strongly recommended that system integrators perform thermal testing on the chassis selected for each configuration of Pentium D processor-based systems, even when using a chassis on the tested chassis list. Also see Table 2 for specific requirements.
Power Supply Selection
Power supplies must comply with either the ATX12V or SFX12V design guidelines (see the Form Factors website for details) and supply additional current on the 12V power rail through a 2x2 connector. All Pentium D processor-based systems require either the standard 2x10, 20-pin ATX power connector or the new 24 pin ATX power connecter as well as the 2x2, 4-pin 12V connector. The Intel® Pentium® Extreme Edition processor requires a power supply wiht a 2x4 connector instead of the 2x2 connector. Additionaly there are specific current requirements for the 12v rails. See table 2 below. Consult the motherboard documentation to determine additonal power supply requirements. Intel tests power supplies to determine a minimum level of electrical compliance. Consult the Tested Power Supply List for more information.
Table 2. Platform Requirements
ProcessorSpecification: | PCG* = 05A | PCG* = 05B | PCG* = 05B (Extreme Edition) |
Power supply requirement for 12V rail: | 13A Continuous, 16.5A Peak for 10ms | 16A continuous, 19A peak for 10ms | Two 12v rails each rated at: 8A continuous, 11A peak for 10ms |
Board (chipset specific) | 945/955X Chipset | 945/955X Chipset | 955X Chipset(Intel® Pentium® processor XE 840), 975X chipset (Intel® Pentium® processor XE 955) |
Chassis | TAC 1.1 | TAC 1.1 Tested for PCG 05B platform See tested chassis list | TAC 1.1 Tested for Extreme Edition CPU See tested chassis list |
*To determine what the PCG of your processor is consult the S-Spec Reference Table. Also see PCG info section of this document.
Top of Section > Table of Contents >
Section Contents Boxed Processor Installation > Maintaining and Upgrading Systems Based on Intel Pentium D Processors in the 775-Land Package >
Motherboards supporting the boxed Intel Pentium D processor include a manual with installation instructions. Consult this manual in addition to the boxed processor manual before building a Pentium D processor-based system. The boxed Intel® Pentium® 4 Processor in the 775-land package integration video also shows the installation process using a boxed Intel Desktop Board (integration procedures are identical for both the Intel Penitum 4 processor and the Intel Pentium D processor). In addition, the following information can aid system integrators in successfully integrating a system based on the boxed Intel Pentium D processor in the 775-land package. Note: When integrating a Pentium D processor-based system, be sure to take the proper electrostatic discharge (ESD) precautions. Consider using ground straps, gloves, ESD mats, or other protective measures to avoid damaging the processor and other electrical components in the system.
Motherboard Handling
- Remove Motherboard from ESD bag (if applicable)
- Visually inspect to ensure socket load lever and load plate are secured CAUTION: Recomend not to open the socket at this time.
- Visually inspect to ensure socket protective cover is present and properly secured
CAUTION: Recommend not to remove the socket protective cover
CAUTION: DO NOT TOUCH SOCKET SENSITIVE CONTACTS
Socket Preparation
- Opening the socket
Note: Apply pressure to the corner with right hand thumb while opening/closing the load lever, otherwise lever can bounce back like a mouse trap and WILL cause bent contacts (when loaded).- Disengage Load Lever by depressing down and out on the hook to clear retention tab
- Rotate Load Lever to fully open position at approximately 135®
- Rotate Load Plate to fully open position at approximately 100®
- Remove socket protective cover
With left hand index finger and thumb to support the load plate edge, engage protective cover finger tab with right hand thumb and peel the cover from LGA775 Socket while pressing on center of protective cover to assist in removal.- Set protective cover aside. Always put cover back on if the processor is removed from the socket.
- Visually inspect protective cover for damage. If damage observed, replace the cover.
NOTE: After cover removal, make sure socket load plate and contacts are free of foreign material. Debris may be removed with compressed air.
NOTE: Removing protective cover after CPU insertion will compromise the ability to visually inspect socket.
- Visually inspect for bent contacts
If any socket/motherboard mishandling is suspected, socket should be closely examined. Closing one eye, inspect socket contacts from different angles to find any damaged contacts. If any are found do not use motherboard. (Since these systems for the lab are non operational, you can use a damaged socket.)
| Figure 5. Do Not Touch Socket Contacts Larger View > | Figure 6. Opening the Socket Larger View > | Figure 7. Remove Protective Cover Larger View > |
NOTE: Glove images are for illustrative purposes only. Please consult local safety guidelines for specific requirements. It is recommend not to hold the load plate as a lever, instead hold at tab with left hand, removing the protective cover with right hand. | ||
Types of contact damage to look for are: (See table 2 for potential causes and solutions)
| Contact is bent backwards upon itself Larger View > | Content is bent forward or downward Larger View > | Contact is bent sideways Larger View > | Content tip is missing or bent up Larger View > |
Table 2. Bent contact causes and corrective actions
| FailureType | Potential Causes | Possible Corrective Action |
| 1,5 |
|
|
| 1,5 |
|
|
| 2 |
|
|
| 3 |
|
|
| 4 |
|
|
Boxed Processor Installation
As a supplement to the manual provided with the boxed processor, install the processor and fan heatsink in the following manner.
Do Not Touch Processor Contacts
Larger View >Processor Handling
- Open boxed processor packaging.
- Visually inspect to ensure processor protective cover is present and properly secured.
CAUTION: Recommend not to remove the processor protective cover. - CAUTION: DO NOT TOUCH PROCESSOR SENSITIVE CONTACTS AT ANY TIME DURING INSTALLATION.
Processor Installation
- Lift processr package from shipping media by grasping the substrate edges ONLY.
NOTE: Orient processor package such that the Connection 1 triangle mark is on bottom left and both key notches are on left side. - Processor Protective Cover Handling: Remove protective cover with the opposite hand by depressing larger retention tab and peeling the cover away (see Figure 8).
- Set and reserve the protective cover aside. Always keep the protective side cover on the processor when not in the socket.
- Visually inspect the package gold pads:
Scan the processor package gold pad array for presence of foreign material. If necessary, the gold pads can be wiped cleaned with a soft lint free cloth and isopropyl alcohol (IPA). - Locate Connection 1 indicator and the two orientation key notches. (Figure9)
- Grasp the processor with thumb and index finger. (Grasp the edges without the orientation notches.) The socket has cutouts for your fingers to fit into. (FIgure10)
- Carefully place the package into the socket body using a purely vertical motion. (Tilting the processor into place or shifting it into place on the socket can damage the sensitive socket contacts.) (see Figure 11)
CAUTION: Recommend not to use a Vacuum Pen for installation. - Verify that package is within the socket body and properly mated to the orientation keys
- (Figure12) Close the socket by
- Close the Load Plate.
- While pressing down lightly on Load Plate, engage the Load Lever.
- Secure Load Lever with Load Plate tab under retention tab of Load Lever.
| Figure 8. Protective Cover Removal Larger View > | Figure 9. Larger View > | Figure 10. Larger View > |
| Figure 11. Larger View > | Figure 12. Larger View > | Figure 13. Larger View > |
Boxed Intel Fan Heatsink Handling
- To prevent damage, avoid setting the thermal solution with the prongs down
- Set on heatsink side or with fan down
Boxed Fan Heatsink Installation
NOTE: The thermal solution integration procedures should be performed with the motherboard in the Chassis to provide proper clearance under the motherboard for the fastener mechanisms.
- Install the motherboard into the chassis.
- Thermal Solutions that come with Intel® boxed processor use pre-applied thermal interface material (TIM) and do not need grease (see Figure 14).
CAUTION: Recommend not to touch or disturb the T.I.M. on the heatsink during installation. - Remove Heatsink (HS) from packaging media.
- Place HS onto the LGA775 Socket (see Figure 15).
- Ensure fan cables are oriented on side closest to fan header.
- Align Fasteners with MB through-holes.
- Make sure fasteners are flush with motherboard (see Figure 16).
- Inspection
- Ensure cables are not trapped or interfere fastener operation.
- Ensure fastener slots are pointing perpendicular to Heatsink. (Figure 15)
- Actuate fasteners (see Figure 17).
- While holding HS to prevent tilting, press down on fastener caps with thumb to install and lock.
- Repeat with remaining fasteners.
- Inspection (see Figure 18).
- Verify the fasteners are properly seated by pulling up on each fastener.
- Ensure both fastener cap and base are flush with spring and motherboard.
- Connect fan cable to Board CPU header. (see Figure 19).
- Secure excess cable with tie-wrap to ensure cable does not interfere with fan operation or contact other components.
| Figure 14. Larger View > | Figure 15. Larger View > | Figure 16. Larger View > |
| Figure 17. Larger View > | Figure 18. Larger View > | Figure 19. Larger View > |
Maintaining and Upgrading Systems Based on the Pentium D Processors in the 775-land Package
Boxed Processor Removal
Every time the heatsink is removed from the processor, it is critical that the thermal interface material be replaced, in order to ensure proper thermal transfer to the boxed processor fan heatsink. Note: Be sure to take the proper electrostatic discharge (ESD) precautions (ground straps, gloves, ESD mats, or other protective measures) to avoid damaging the processor and other electrical components in the system.
Caution: If you find that considerable force is required to remove the boxed processor assembly, consider wearing gloves to protect your hands and take care to keep your hands away from any metal edges on the chassis when removing components.
Thermal Interface Material Attached to the Heatsink
Intel does not recommend the removal of the thermal interface material located on the bottom of the boxed processor fan heatsink. Removal of this material may cause damage to the processor and will void the boxed processor warranty. If you must remove and re-use the fan heatsink, it will require replacement. Also, if the thermal interface material is at all damaged, you must also replace the fan heatsink. Contact Intel Customer Support to receive a replacement fan heatsink.
Follow these steps to remove the boxed processor fan heatsink from the system:
- Disconnect fan cable from motherboard header
- Turn fastener caps (1) counter-clockwise 90 degrees to the un-locked position (see Figure 20). (You may need to use a flathead screwdriver to unlock the fasteners) NOTE: Do not over rotate the fasteners.
- Pull up on fastener caps to unseat (see Figure 20).
- Manually remove heatsink with gentle twisting motion.
- To re-assemble the heatsink, reset the fastener caps to their original position with the slot perpendicular to the heatsink. Re-attach cable to cable management clips. Then, follow the assembly instructions.
Follow these steps to remove the boxed processor fan heatsink from the system:
- To open the socket
- Disengage the Load Lever
- Open the Load Plate
- Pick up FC-LGA4 processor package:
Note: You may use a vacuum pen to remove the processor.
By Hand: Grasp processor with Index finger to hold the load plate hinge side and thumb to hold load lever side.
By Vacuum Pen: Place a minimum 9-mm cup at approximately the center of the Integrated Heat Spreader (IHS). The IHS is the metal portion on top of the processor.)
NOTE: Do not place vacuum pen on IHS edge, due to risk of dropping processor and causing bent contacts. Recommend not to use Vacuum Pen for inserting CPU. - Lift the package straight up and away.
- Assemble processors protective cover immediately to prevent contamination.
- While holding the processor by the 3 corners, with the other hand lift the processor cover from work surface by grasping at the large retention tabs. Ensure retention tabs and processor contacts are pointing each other.
- Orientate so the protective cover chamfer is matching with package Connection 1 location.
- Hook the first large retention tab on the processor substrate. Then press the opposite tab onto the processor
- Place processor with land side cover installed onto proper shipping media or other ESD approved work surface
- Visually inspect socket contacts
- First Pass Inspection
- Scan socket contact array at varying angles noting the presence of any foreign material
- If foreign material can be blown off by compressed air, or mechanical damage (Type 1 or 4. See 5 Types of Socket Contact Damage) observed, reject the motherboard for further evaluation or socket replacement.
- Second Pass Inspection
- Repeat 2 more times to sight down the rows and columns from each of the 4 sides of the socket to ensure all contacts within the array are inspected
- Inspect for Type 2, Type 3, and Type 5 failures
- First Pass Inspection
- Assemble LGA775 socket protective cover
- Hook protective cover back onto load plate, attaching bottom first, then clip thumb tab.
- Close the Socket load plate and engage the load lever.
| Figure 20. Larger View > | Figure 21. Larger View > | Figure 22. Larger View > |
| Figure 23. Larger View > | Figure 24. Larger View > | Figure 25. Larger View > |
| Figure 26. Larger View > |
Software and Operating System Considerations
The Intel dual-core processor is an evolution of HT Technology. Both HT Technology and a dual-core processor enable a multi-threaded experience for applications written to take advantage of multiple threads, but dual-core processing brings more resources and computing throughput to the PC. In other words, dual-core processing does what Hyper-Threading Technology does, but brings more computing resources and is designed for demanding multitasking. In addition, dual-core processing allows for true simultaneous computing so multiple users can access and enjoy the same PC, even from different rooms with a home network and networked devices (such as a stereo connected via a DMA).
The Intel Pentium D processor includes support for Streaming SIMD Extensions 3. These thirteen additional instructions have been added to the existing 144 instructions, including SIMD double precision floating-point, SIMD 128-bit integer, and cache and memory management instructions. SSE3 enhances performance to accelerate the most demanding aspects of Internet computing, as well as video, speech, encryption, imaging, and non-threaded workstation applications.
Operating System Support
Nearly all modern operating systems designed for the Intel Architecture have support for the Pentium D processor, although some may require specific versions or processor support files. Microsoft* Windows Vista* or Windows XP* supports the Pentium D processor. Additionaly, Linux* distributions based on the Linux* 2.4 core support the processor. Also, many other vendors have support for the Pentium D processor in their operating systems. System integrators should verify that the operating system they have selected supports the Pentium D processor.
Operating system support for Intel® 64 can be found in the Intel® 64 How to doucument.
Software Optimization
Multi-threaded applications optimzed for HT Technology can benefit even more on a dual core processor. No additional optimizations are required.
With specific drivers that use the SSE3 instructions, graphics accelerators, audio hardware and software, and other system resources can experience substantial performance gain. Graphics card vendors typically highlight support changes with new driver releases. Download and install the latest drivers from the vendor's website. Also, verify that the driver version contains optimization for the Pentium D processor.
Many applications also take advantage of 64-bit computing with specific optimizations for the Intel Pentium D processor. In order to take advantage Intel 64, an entire 64bit hardware & software solution stack is required, ranging from processors and device drivers to operating systems, tools and applications. Contact your software vendor for availalbe Intel 64 support.
System performance is greatly affected by proper operating system and driver installation processes. For example, it is important to install the latest Intel® Chipset Software Installation Utility immediately after installing most Microsoft operating systems to ensure proper drivers for the chipset are installed prior to installation of other drivers. System integrators should confirm boxed Intel Pentium D processor-based systems are optimally configured and integrated.
Conclusion
Boxed Intel Pentium D processor-based systems require proper integration. System integrators that follow the guidelines in this document will experience higher customer satisfaction by providing higher quality systems.
- Hyper-Threading Technology requires a computer system with an Intel® Pentium® Processor Extreme Edition and an HT Technology enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. See www.intel.com/products/ht/hyperthreading_more.htm for more information including details on which processors support HT Technology.
- Hyper-Threading Technology requires a computer system with an Intel® Pentium® D processor supporting HT Technology and a Hyper-Threading Technology enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. that includes optimizations for this technology. See www.intel.com/products/ht/hyperthreading_more.htm for more information including details on which processors support HT Technology.
- Power savings from Enhanced Intel SpeedStep® technology may vary depending on system usage and design.
- Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.
- Intel 64 requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel 64. Processor will not operate (including 32-bit operation) without an Intel 64-enabled BIOS. Performance will vary depending on your hardware and software configurations. See Intel® 64 Architecture page for more information including details on which processors support Intel 64 or consult with your system vendor for more information.
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