Motherboard/chassis test configurations
The server board/chassis combinations were tested at an ambient room temperature of 35°C.
|Motherboard||1||Green City||Intel||Customer Reference Board w/ Tylersburg Chipset (IOH), ICH9, and VRD 11.1|
|Processor||2||Intel® Xeon processor 5500 series||Intel||2.53GHz Characterized 95W TDP CPU|
|CPU Heatsink||2||STS100C||Intel Box Heatsink||Intel® Thermal Solution STS100C, Intel® Thermal Solution STS100P1|
|Thermal Interface Material (TIM)||2||G-751||ShinEtsuMicrosi*||CPU Heatsink Thermal Grease|
|Memory||12||EBJ41HE4BAFA-DJ-E||Elpida*||4GB Registered DDR3 SDRAM DIMM 2Rx4,
Characterized 4.02GB/s per DIMM
|Memory VR Heatsink||2||Intel||Intel||VR Extruded Aluminum Heatsink2|
|VR Heatsink||2||Intel||Intel||VR Extruded Aluminum Heatsink2|
|IOH Heatsink||1||Intel||Intel||Extruded Aluminum Short Heatsink2|
|Hard Drive||8||ST380815AS||Seagate*||Barracuda 7200.10 SATA 3.0Gb/s 80GB (Test config up to 8 HDD)|
|Optical Drive||1||LTN-526S||LiteOn*||LiteOn CD-RW 52x|
|Graphic Card||1||Intel||Intel||Integrated Graphic|
|Add-in Card||5||Intel||Intel||PCI Thermal Load Card
|Power Supply||1||DPS-670DB A||Delta*3||670W Output Power|
1The chassis will be tested with the Intel® Thermal Solution that supports the chassis type unless supplier provides their own thermal solution. The Intel® Thermal Solution STS100C will be used for all Pedestal chassis and for 2U chassis with the fan removed. The Intel® Thermal Solution STS100P will be used for all 1U rackmount chassis.
2Included with motherboard
3Testing is performed with the power supply that was installed in the chassis. If there was not a power supply installed in the chassis then the DPS- 670DB A would be used to perform the tests.