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Intel® Carrier Grade Server TIGPR2USpecifications

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Processor/CacheOne or two Intel® Xeon® processor(s) with 512KB of integrated L2 cache, 1MB integrated L3 cache and a 400MHz or 533MHz system bus.
System Memory
Memory CapacitySix DIMM sockets for up to 12 GB of registered ECC DDR266 memory1.
Memory TypeRegistered ECC DDR266 SDRAM 72-bit, 184-pin gold-plated DIMMs.
DIMM Sizes128 MB, 256 MB, 512 MB, 1 GB, 2 GB.
Memory Voltage2.5 V only
Error DetectionCorrects single-bit errors, detects doublebit errors (using ECC memory), and provides Intel® x4 Single Device Data Correction support (using x4 DRAM devices only).
Integrated On-board
ChipsetIntel® E7501 Chipset
Ultra320 SCSI Single Channel ControllerAdaptec* AIC-7901 (single-ended mode not supported).
Intel® PRO Network ConnectionsTwo Intel® PRO Network Connections via RJ45 connectors (10/100/1000 Intel® 82546EB Gigabit Ethernet Controller)
GraphicsATI* Rage* XL SVGA PCI video controller with 8 MB of video memory.
Super I/O ControllerNational Semiconductor* PC87417.
Input/Output
PCIThree independent PCI buses, 6 total slots: four PCI-X 64-bit/100MHz3, 2 PCI 32-bit/33MHz.
IDETwo ATA/100 EIDE channels for a total of four IDE devices backward compatible to provide CD-ROM drive support.
USBFive USB 1.1 compliant ports: three stacked USB connectors on I/O rear panel, two via 10-pin internal header.
Serial PortsTwo serial ports: 1 asynchronous 9-pin RS-232C, one via 10-pin internal header.
Floppy Controller1.44 MB, 2.88 MB, 3-mode support.
Keyboard/MouseTwo PS/2 ports, 8240A-compatible.
Intel® Server Management
HardwareIntegrated Baseboard Management Controller (BMC) and instrumentation.
Remote ManagementRemote access to system status, system control, logs, configuration data, and utilities without the need for a remote management card. Event filtering and proactive alerting through LAN and mobile devices. Serial and console redirection over LAN.
Server Monitoring and RecoverySystem health indicators and corrective actions including automated power cycling, OS watchdog timer, and fault-resilient booting.
Server TroubleshootingContinuous health monitoring, text console redirection, and error logs.
Server MaintenanceOne-Boot Update and integrated Intel® SMaRT tool module for Intel® Server Board SE7501HG2.
Intelligent Platform Management SupportIntelligent Platform Management Interface (IPMI) 1.5.
Operating Systems Supported by Intel® Server ManagementMicrosoft Windows* 2000 Advanced Server, Red Hat* Linux*, NetWare*, Caldera OpenUnix.
 

 

Intel® TIGPR2U Front Panel
Front Features
A. Peripheral Bay 1 - Floppy DriveE. SCSI Drive Bay
B. Peripheral Bay 2 - CD-ROM DriveF. Hard Drive Bay Cable Connector
C. Front Panel Switches and LEDsG. Hard Drive Bay Power Connector
D. Hard Drive TrayH. SCSI Drive Bay
Front Panel Control Switches and Status LED Features 
Intel® TIGPR2U Front Control Panel
A. Power switchH. Disk 2 Activity/Fault LED (green/amber)
B. Reset switchI. Main power LED (green)
C. Alarm: CRTJ. NIC0/NIC1 activity LED (green)
D. Alarm: MJRK. System ID LED (white)
E. Alarm: MNRL. ID switch
F. Alarm: PWRM. NMI switch
G. Disk 1 Activity/Fault LED (green/amber) 
Intel® TIGPR2U Rear Panel
Rear Features
A. PCI Card bracket (low profile)
B. RJ-45 NIC 2 connector - Green Status LED/Yellow Status LED
C. DB15 Alarm Connector
D. PCI Card Bracket (full-height)
E. DC power input (primary)
F. DC power input (redundant)
G. Power supply module, redundant (system accessory)
H. Power supply module (primary)
I. USB connector 0
J. RJ-45 serial 2 port
K. PS/2 mouse/keyboard connector - requires dongle ("Y" cable) to connect both keyboard and mouse
L. RJ-45 NIC 1 connector
M. U-320 SCSI connector
N. Video Connector
O. USB Connector 1
 

 

Server Physical Dimensions
Height3.45 inches (87.6 mm)
Width17.11 inches (434.6 mm)
Depth20 inches (508 mm)
Front clearance2 inches (50.8 mm)
Side clearance1 inches (25.4 mm)
Rear clearance3.6 inches (92 mm)
Intel TIGPR2U complies with the following Safety, EMC and NEBS regulations:
Safety
U.S., CanadaUL1950 — CSA 950 (UL and cUL)
Europe, CE MarkEN60950 (complies with 73/23/EEC)
InternationalIEC60950 (CB Report and Certificate)
RussiaGOST
EMC (note 1)
U.S.FCC, Part 15, Class A
CanadaICES-003, Class A
Europe, CE MarkEN55022 (Class A); EN55024 and EN61000-3-2;-3-3 (complies with 89/336/EEC)
InternationalCISPR 22, Class A
JapanVCCI, Class A
TaiwanCNS13438, Class A
KoreaRRL, MIC 1997-41 and 1997-42
RussiaGOST
Australia, New ZealandAS/NZS 3548 (based on CISPR 22)
NEBS/ETSI
Bellcore GR-63, Physical Protection Requirements
Bellcore GR-1089, Electromagnetic Compatibility and Electrical Safety Req.
ETSI 300 386, Telecommunication Network, Electromagnetic Compatibility
ETSI 300 019, Environmental Conditions and Environmental Tests
ETSI 753, Acoustic Noise
Environmental Specifications
Temperature non-operating5°C to 40°C (41°F to 104°F).
Altitude0 to 3,962 m (0-13,000 ft).
Humidity non-operating95%, non-condensing at temperatures of 23°C (73°F) to 40°C (104°F).
Vibration operatingSwept sine survey at an acceleration amplitude of 0.1 g from 5 to 100 Hz and back to 5 Hz at a rate of 0.1 octave/minute, 90 minutes per axis on all three axes as per Bellcore GR-63-CORE standards.
Vibration non-operatingSwept sine survey at an acceleration amplitude of 0.5 g from 5 to 50 Hz and back to 5 Hz at a rate of 0.1 octaves/minute, and an acceleration amplitude of 3.0 g from 50 to 500 Hz at a rate of 0.25 octaves/minute, on all three axes as per Bellcore GR-63-CORE standards. 2.2 Grms, 10 minutes per axis on all three axes as per the Intel® Environmental Standards Handbook.
EmissionsVerified to FCC Class A; tested to CISPR 22 Class A, EN 55022 Class A, VCCI Class A ITE, AS/NZS 3548 Class A, CNS13438.
ImmunityVerified to comply with EN 55024.
Shock operatingHalf-sine 2 G, 11 ms pulse, 100 pulses in each direction, on each of the three axes as per the Intel® Environmental Standards Handbook.
Shock non-operatingTrapezoidal, 25 G, 170 inches/sec delta V, 3 drops in each direction, on each of the 3 axes on each of the 3 axes as per the Intel® Environmental Standards Handbook.
Electrostatic Discharge (ESD)Tested to ESD levels up to 15 kilovolts (kV) air discharge and up to 8kV contact discharge without physical damage as per Intel® Environmental Standards Handbook.
AcousticSound pressure: < 55 dBA at ambient temperatures < 28°C measured at bystander positions in operating mode.

1The Ultra320 SCSI drive bays are compatible with Ultra2 SCSI.

2Class A EMC compliance is based on integration with a validated Intel server board and configured as outlined in the SC5200 Chassis Subassembly Installation Guide.