Intel® 852GME ChipsetOverview
The Intel® 852GME Chipset, optimized for the Mobile Intel® Pentium® 4 processor, features a 533 MHz system bus and up to 2 GB of high-speed DDR 333/266/200 memory. Intel® Extreme Graphics 2 technology enables intense, realistic 3D graphics and an AGP 4X interface enables over 1 GB/s of graphics bandwidth interface for high-quality 2D, 3D and video streams.
Product information
Features and benefits
| 533/400 MHz system bus |
Supports 533/400 MHz system bus for single processor configurations. |
| Supports up to 2 GB of
DDR 333/266/200 memory technology |
Higher performance & flexibility. |
| Integrated Low Voltage Differential Signaling interface (LVDS) |
Higher integration which saves board space. Supports up to 1600x1200 UXGA+ panel resolution. |
| Dual independent pipe for dual independent display |
View 2 independent images on different displays. |
| Screen image rotation |
Ability to rotate the screen image 90°, 180° or 270°. |
| 6
USB 2.0 ports. Backwards compatible to USB 1.1 |
High-speed USB 2.0 peripheral support. |
| Low power design |
Advanced mobile power management. |
| Intel® Extreme Graphics 2 technology |
Delivers intense, realistic 3D graphics with sharp images and enables balanced memory usage between graphics and system for optimal performance. |
| AGP 4X interface |
Provide the advanced graphics support available, enabling over 1 GB/s of graphics bandwidth interface for high-quality 2D, 3D and video streams. |
| Enhanced Intel SpeedStep® Technology |
Real-time dynamic switching of voltage and frequency between maximum performance and battery-optimized operation, based on CPU demand, for longer battery life. |
| Deeper sleep alert state |
New dynamic power management mode operates at lower voltage than deep sleep mode for longer battery life. |
| Ultra ATA/100 |
Takes advantage of the latest industry innovations in HDD features and performance. |
| Thin and small package technology |
Intel® 852GME chipset uses Intel's most advanced Flip-Chip Ball Grid Array (FCBGA) packaging that is excellent for reducing package size and improves the chipset cooling capability. |
Related products
Packaging information
| 82852GME (MCH) |
732 pin Micro-FCBGA |
| 82801DBM (ICH4-M) |
421 pin Micro-BGA |
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